NYIPLA student writing competition

 The New York Intellectual Property Law Association (NYIPLA) is currently accepting submissions for the Hon. William C. Conner Intellectual Property Law Writing Competition. Further information can be found on: https://www.nyipla.org/nyipla/ConnerWritingAwards.asp.

Award Name

Hon. William C. Conner Writing Competition

Award Provided by

New York Intellectual Property Law Association (NYIPLA)


Sunday, February 27, 2022

Number of Awards

One (1) first place award in the amount of $1,500 and one (1) runner-up award in the amount of $1,000.

Provider Website URL



The New York Intellectual Property Law Association serves as a vehicle to promote the development and administration of intellectual property interests. NYIPLA strives to educate the public and members of the bar in this particular field and continually works with foreign associations to harmonize the substance and interpretation of international conventions for the protection of intellectual property. Today, the NYIPLA exceeds 1,500 intellectual property attorneys practicing throughout the United States and abroad. The Association has a combined total of twenty-four active Committees and Delegates, whose scope covers all aspects of intellectual property law and practice and related topics, including alternative dispute resolution, legislative oversight and amicus briefs, meetings and forums, and continuing legal education.  

About the Award

The Hon. William C. Conner Writing Competition was established to recognize exceptionally written papers that are submitted by law students and is presented each year at the Annual Meeting and Awards Dinner. The competition is open to students enrolled in a J.D. or LL.M. program (day or evening). The subject matter must be directed to one of the traditional subject areas of intellectual property, i.e., patents, trademarks, copyrights, trade secrets, unfair trade practices, antitrust, and data security/privacy issues. Entries must be submitted electronically by Sunday, February 27, 2022, to Richard Brown, rbrown@daypitney.com.

For Eligibility and Submission Requirements Visit



Lea Tejada

E-mail Address


Contact Phone Number

(201) 461-6603

Fax Number

(201) 461-6635

Mailing Address

2125 Center Avenue, Suite 616, Fort Lee, New Jersey 07024

from Blogger https://ift.tt/3xGx0B3

This entry was posted in Uncategorized and tagged . Bookmark the permalink.

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out /  Change )

Twitter picture

You are commenting using your Twitter account. Log Out /  Change )

Facebook photo

You are commenting using your Facebook account. Log Out /  Change )

Connecting to %s